Automotive

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Designing Communications Equipment

Microsemi has a solid history serving the automotive industry. From ADAS systems to body electronics, infotainment, powertrain and electric vehicle charging, our dedicated portfolio is engineered to meet demanding automotive requirements.

Explore our solutions for automotive applications:

• Audio-voice processors
• Automotive-grade FPGAs & SoCs
• High voltage stack diodes
• IEEE 802.11 Wi-Fi RF power amplifiers(PAs),linear amplifiers,(LNAs) andfront end modules(FEMs)
• Power management devices includingdiodes,diode modules,IGBTs,IGBT modules,MOSFETs,MOSFET modules,SiC MOSFETs,SiC Schottky diodes,SiC power modules, andPower Line Communication (PLC) line drivers
• Sensor interface ICs
• Timing ICs
• Transient Voltage Suppressor (TVS) diodes

Contact yourlocal Microsemi sales officetoday to find the right technologies and products to solve your next-gen automotive design challenges.

Why Choose Microsemi

一个资源urce You Can Trust

As a leading supplier to the automotive market, Microsemi services a broad variety of applications including advanced driver assist (ADAS), collision avoidance and infotainment systems, power management, motion sensing, motor control, telematics and more.

Automotive Capabilities & Support Teams

• Customer engineering support
• Automotive quality and failure analysis
• Access to TS16969-certified fabs and assembly
• Complete PPAP documentation

• AEC-Q100 and AEC-Q101 compliant designated parts
• 30+ years of high-rel experience in aviation and military
• Typical product lifetime 15+ years

Quality Model
Facility Certifications

• ISO 9001:2008 certification of all Microsemi Integrated Circuits (ICs) Groups
• ISO/TS16949, ISO 9001-2000 and ISO14001 certification of all major assembly subcontractors and foundries

Qualifications Conformance

• JESD47 Stress-Test-Driven Qualification of ICs
• EIAJ ED-4701 Environmental and Endurance Test Methods for Semiconductor Devices
• MIL-PRF-38585 Performance Specification - IC (Microcircuits) Manufacturing, General Specification
• MIL-STD-883 Test Methods and Procedures for Microelectronics

Embedded Firmware

• Conformance to MISRA-C:2004 (per ISO26262)

• Quarterly QBR/scorecard for key suppliers
• Asia subcontractor management team
• Supplier scorecard, reports, audits common across BUs
• Strategic partnerships with key suppliers
• On-site engineering support at key suppliers
• Supplier improvements driven through SCARS & scorecards
• Supplier risk management (identification, evaluation, mitigation)
• Ongoing review of CPK data

XFab Automotive Wafer Service

• Priority FA with 8d report including method documentation
• APQP/PPAP collaboration with customers for new products
• Automotive audits (e.g. VDA6.3) by both the customer and supply chain, including OEM
• 15-year record retention
• ISO/TS16949:2009 certified quality management system as precondition for automotive business
• AECQ100 qualification test methods Group D, plus additional nonvolatile memory tests
• 100% automated outgoing inspection (AVI) for volume production - all lots, all wafers, all dies
• AVI electronic wafer map available for customer purpose
• Cpk-monitored PCM parameter testing (Cpk target ≥ 1.67)
• Monthly Cpk reporting
• Extended PCM test: Stringent PCM screen results (3/5 pass, additional PCM tests for reliability parameters)
• Probing data/yield/ppm feedback from customer to trigger continuous improvement activities

Contact yourlocal Microsemi sales officetoday to find the right technologies and products to solve your automotive design challenges.